PCB Types We Manufacture
We offer a comprehensive range of PCB types to meet the diverse needs of our customers across all industries and applications.
Single-Sided
1-layer PCB for simple circuits and cost-effective applications
Double-Sided
2-layer PCB with through-hole technology for moderate complexity
Multi-Layer (1-32L)
Complex multilayer boards up to 32 layers for advanced applications
HDI PCB
High Density Interconnect boards with microvias and fine lines
Flexible PCB
Flex circuits for dynamic bending and space-constrained designs
Rigid-Flex PCB
Combined rigid and flexible sections for 3D space optimization
High-Frequency PCB
Rogers and specialized materials for RF and microwave applications
Metal-Core PCB
Aluminum base PCBs for superior thermal management in LED and power
Technical Specifications
Our advanced manufacturing capabilities allow us to produce PCBs with the tightest tolerances and highest quality standards.
| Parameter | Specification |
|---|---|
| GENERAL FABRICATION | |
| Layer Count | 1 – 32 layers standard production; up to 40 layers for advanced HDI builds |
| Maximum Panel Size | 610mm × 1200mm (24" × 47") |
| Finished Board Thickness | 0.2mm – 8.0mm (±0.08mm for boards ≥1.0mm) |
| Min Trace / Space | 2.5 / 2.5 mil (0.064mm) advanced; 3 / 3 mil production |
| Copper Weight | 0.5oz – 10oz standard; heavy copper up to 20oz (700μm) |
| Min BGA Pad / Pitch | 0.25mm (10mil) pad / 0.4mm pitch |
| Warp & Twist | ≤ 0.5% per IPC-A-600 |
| Quality Class | IPC-6012 Class 2 & Class 3 (high-reliability) |
| DRILLING & VIA STRUCTURES | |
| Min Mechanical Drill (finished) | 0.15mm (6mil) |
| Laser Microvia | 0.075mm (3mil), 1:1 aspect ratio |
| PTH Aspect Ratio | Up to 12:1 |
| Via Structures | Through-hole, blind / buried vias, stacked & staggered microvias, via-in-pad (resin-plugged & copper-capped) |
| HDI Build-Up | 1+N+1, 2+N+2, 3+N+3 and Any-Layer Interconnect (ELIC) |
| Back-Drilling | Controlled-depth back-drilling, residual stub ≤ 8mil |
| Hole Plugging | Resin / epoxy plug, silver-filled & conductive paste |
| IMPEDANCE & MATERIALS | |
| Controlled Impedance | ±5%, single-ended & differential, TDR-coupon verified |
| Dielectric Thickness | 0.05mm minimum core / prepreg |
| High-Speed / RF Materials | High-Tg FR4 (Tg 170/180), Rogers RO4003C / 4350B / 5880 / 3003 / 3010, Taconic TLY-5, Isola Astra MT77, Panasonic Megtron 6 / 7 / 8, Shengyi S7439, PTFE |
| Dk / Df Range | Dk 2.2 – 10.2; Df as low as 0.0014 @ 5GHz |
| Metal Core & Flex | Aluminum / copper-base MCPCB, polyimide FPC & rigid-flex, CEM-1 / CEM-3 |
| SURFACE FINISH & COMPLIANCE | |
| Surface Finish | Lead-free HASL, ENIG (1–3μ" Au / 120–240μ" Ni), ENEPIG, immersion silver / tin, OSP, electrolytic hard gold 3–30μ" (edge connectors), bondable soft gold |
| Solder Mask / Legend | Green, black, white, red, blue, yellow; matte or glossy; white/black legend |
| Compliance | UL recognized (E-file), RoHS, REACH, halogen-free available |
Capability Highlights
Rapid Prototyping
24-48 hour turnaround for prototype PCBs. Get your designs tested and validated faster than ever with our express manufacturing service.
Advanced HDI Technology
State-of-the-art HDI manufacturing with laser drilling, sequential lamination, and microvia technology for the most demanding designs.
Impedance Control
Precise impedance control with ±10% tolerance for high-speed digital and RF applications. Simulated and tested to ensure signal integrity.
High-Mix Low-Volume
Flexible manufacturing supporting high-mix, low-to-medium volume production with no minimum order quantity. Perfect for diverse project needs.
High-End Material Solutions
We stock and process the full range of high-performance laminates for 5G/RF, high-speed digital, automotive radar and power electronics — with full lot traceability and material C of C.
| Material Grade | Typical Applications |
|---|---|
| High-Tg FR4 / Low-Loss FR4 Tg 170–180°C, Df 0.008–0.014 | Automotive, industrial controls, high-layer-count backplanes |
| Panasonic Megtron 6 / 7 / 8 Df 0.002–0.005 ultra-low loss | AI servers, 112G/224G high-speed links, switches & routers |
| Rogers RO4003C / 4350B Dk 3.38–3.48, controlled Dk | RF front-ends, base stations, antennas, phase-matched arrays |
| Rogers RO5880 / 3003 / 3010 Dk 2.2–10.2 PTFE-based | Millimeter-wave, radar, satellite, 77GHz automotive radar |
| Taconic / Isola Astra MT77 / Shengyi Mixed-dielectric builds | Cost-optimized 5G, RF hybrids, low-loss digital |
| Aluminum / Copper Metal-Core IMS with 1–8W/m·K dielectric | LED lighting, power modules, EV motor drives |
| Polyimide Flex & Rigid-Flex Adhesiveless PI, dynamic flex rated | Wearables, medical probes, camera modules, aerospace |
Application Areas
Our PCB fabrication services support a wide range of industries and applications: