Assembly Services
We offer a full range of PCB assembly services to meet every project requirement, from simple single-sided boards to complex multi-layer assemblies with fine-pitch components.
SMT Assembly
Surface Mount Technology with high-speed pick-and-place machines. Supporting 0201 to large BGA components with precision alignment.
Through-Hole
Wave soldering and hand soldering for through-hole components. Ideal for high-reliability applications requiring robust mechanical connections.
Mixed Technology
Combined SMT and through-hole assembly on the same board. Leveraging the benefits of both technologies for optimal performance.
Box Build
Complete box build assembly including mechanical integration, cable harnessing, firmware loading, and final product packaging.
Assembly Capabilities
Our advanced assembly lines are equipped with the latest technology to handle the most demanding PCB assembly requirements.
01005 (0.4mm x 0.2mm) chip placement at ±25μm accuracy, 0201 in routine production
Micro-BGA, WLCSP and QFP placement down to 0.3mm pitch with 3D X-ray inspection
High-speed SMT lines capable of placing up to 80,000 components per hour for mass production
SMT Process Capability Matrix
Our high-end SMT lines are built for ultra-fine-pitch, high-reliability assembly — from 01005 chip components to 0.3mm-pitch microBGAs.
| Process Item | Capability |
|---|---|
| COMPONENT PLACEMENT | |
| Smallest Chip Component | 01005 (metric 0402, 0.4mm × 0.2mm); 0201 in routine production |
| Placement Accuracy | ±25μm @ 3σ (Cpk ≥ 1.67) |
| Fine-Pitch Lead Packages | QFP / QFN / DFN down to 0.3mm pitch |
| BGA / CSP / WLCSP | Min ball pitch 0.3mm, min ball diameter 0.2mm; micro-BGA & wafer-level packages |
| Advanced Packaging | Package-on-Package (PoP), LGA, COB, press-fit connectors, odd-form & connectors up to 150mm |
| Max Component Height | 25mm standard; taller on request |
| BOARD & PRINTING | |
| Assembly Board Size | Min 50mm × 50mm; max 610mm × 550mm; panelization with edge rails & fiducials |
| Board Thickness | 0.4mm – 6.0mm (flex & rigid-flex supported with carriers) |
| Stencil Technology | Laser-cut electro-polished stainless steel, nano-coated, step stencils 0.08–0.20mm |
| Solder Paste | Type 3 / 4 / 5 no-clean & water-soluble; SAC305 lead-free, Sn63Pb37 & low-temperature alloys |
| Paste Inspection | 100% 3D SPI — volume, area, height & offset with closed-loop feedback |
| SOLDERING & STANDARDS | |
| Reflow Soldering | 10-zone nitrogen convection ovens, O₂ < 1000ppm; leaded / lead-free profiles with real-time profiling |
| Other Soldering | Selective wave soldering, wave soldering, pin-in-paste through-hole reflow (THR), hand soldering by IPC-certified operators |
| BGA Rework | IR/convection rework stations with split-vision & profile control |
| Conformal Protection | Underfill, conformal coating (acrylic / silicone / urethane), potting |
| Quality Standards | IPC-A-610 Class 2 & Class 3, IPC J-STD-001, IPC-7711/7721 rework, ANSI/ESD S20.20, IPC/JEDEC J-STD-033 MSD control |
Assembly Process Flow
Our rigorous assembly process ensures every board meets the highest quality standards from start to finish.
Solder Paste Printing
Precision solder paste application using laser-stenciled stainless steel stencils
Pick & Place
High-speed automated component placement with fiducial alignment
Reflow Soldering
Multi-zone reflow oven with optimized thermal profiles for reliable joints
AOI Inspection
Automated Optical Inspection for solder quality and component placement verification
X-Ray Inspection
3D X-ray inspection for BGA, QFN, and hidden solder joint verification
Functional Test
Comprehensive functional testing to validate complete circuit operation
Advanced Assembly Techniques
Beyond standard SMT, we deliver the specialized processes demanded by modern high-density, high-reliability products.
PoP & Stacked-Die Assembly
Package-on-Package stacking with controlled dip flux / paste, precise coplanarity control and X-ray verification for memory-on-processor architectures.
Micro-BGA & WLCSP
Reliable assembly of 0.3mm-pitch microBGAs and wafer-level chip-scale packages with type-5 paste, laser stencils and nitrogen reflow.
Via-in-Pad Assembly
Assembly over resin-plugged, copper-capped via-in-pad pads — no voiding, flat coplanar surface for high-I/O BGAs.
Nitrogen Reflow
10-zone nitrogen ovens with O₂ below 1,000ppm ensure bright, void-free joints on lead-free SAC305 and difficult RF packages.
Underfill & Conformal Coating
Precision underfill for CSP/BGA thermal cycling survival, plus acrylic, silicone and urethane conformal coating for harsh environments.
Press-Fit & Pin-in-Paste
Pneumatic press-fit connectors and through-hole reflow (THR) for power connectors without secondary wave soldering.
Inspection & Process Control
Every critical station is gated by closed-loop inspection, with full traceability from incoming material to outgoing shipment.
3D SPI
100% solder-paste volume, area and height measurement with SPC feedback to the printer.
3D AOI
Pre- and post-reflow automated optical inspection catches defects immediately, before value is added.
3D X-Ray (AXI)
Void rate, bridging and hidden-joint analysis for BGA/QFN/LGA — IPC-A-610 Class 3 void criteria.
ICT & Flying Probe
In-circuit test and flying-probe verification for shorts, opens, values and polarity.
Functional & Boundary Scan
Custom FCT fixtures, JTAG boundary scan, firmware loading and burn-in testing.
SPC & Traceability
Cpk monitoring, first-article inspection (FAI), MSD J-STD-033 control and serialized lot genealogy.
Turnkey vs Consignment Assembly
We offer flexible assembly options to suit your project needs and supply chain preferences.
★ Turnkey Service
Complete end-to-end service — we handle everything from PCB fabrication and component procurement to assembly and testing.
- ✓ PCB fabrication included
- ✓ Component sourcing & procurement
- ✓ Assembly & soldering
- ✓ Testing & quality inspection
- ✓ Single point of contact
◆ Consignment Service
You provide the components, we provide the assembly expertise. Ideal when you have existing supplier relationships or specialty components.
- ✓ Your components, our expertise
- ✓ Flexible supply chain control
- ✓ Professional assembly & soldering
- ✓ Full quality inspection
- ✓ Cost-effective for existing BOMs